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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 14 ? 001 motor/actuator drivers for dc brush motor series automotive 2ch 60v max, h-bridge drivers BD16922EFV-M general description the BD16922EFV-M is a 1.0a-output, 2-channel automotive reversible motor driver that allows for operation mode selection from four modes; brake, forward, reverse, and standby, according to two-input logical operation. this motor driver provides high voltage (up to a rating of 60v), low on resistance, and compact package, thus leading to contribution to enhancing the reliability, reducing the power consumption, and cutting the cost of sets. features ? aec -q100 qualified (note 1) ? 1 built-in 1.0a dmos h bridge output 2 circuit ? 2 input control (stand by, forward rotation, reverse rotation, brake) ? low standby current ? built-in output counter-electromotive force absorption diode ? built-in overcurrent protection circuit (detection and timer) (ocp) ? built- in overvoltage protection (ovp ) ? built-in thermal shutdown (tsd) ? built-in overcurrent protection state output terminal (po) (note1 : grade 2) ap plications (note 2) for automotive (air conditioner, and door mirror) key specifications ? power supply voltage 8v to 36v ? output current 1.0a (max) ? output on resistance (total of upper and lower resistance) 2.25 (typ) ? operating temperature range - 40 c to +110c package(s) w (typ ) x d (typ ) x h (max ) htssop- b2 4 7.8mm 7.6mm 1.00 mm typical application circuit figure 1. typical application circuit (note 2 ) please make sure you consult our company sales representative b efore mass production of this ic, if used other than door mirror and hvac. 5v m in1p in1n sgnd1 po1 pgnd1 out1pout1p out1nout1n pvcc1 pgnd1 in2p in2n sgnd2 po2 pgnd2 out2pout2p out2n out2n pvcc2 pgnd2 pvcc1 pvcc2 BD16922EFV-M m 5v 12 3 4 5 6 7 8 9 1011 12 13 14 15 16 17 18 19 20 21 22 23 24 datashee t downloaded from: http:///
2/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M pin configuration pin description (top view) in1p 1 2 in1n sgnd1 3 po1 4 pgnd1 5 out1p 6 out1p 7 out1n 8 out1n 9 pvcc1 10 11 in2p 24 23 in2n sgnd2 22 po2 21 20 pgnd2 19 out2p 18 out2p 17 out2n 16 out2n 15 pvcc2 14 pgnd1 pvcc1 12 pvcc2 13 pgnd2 thermal pad (gnd) figure 2. pin configuration block diagram pin no. pin name function 1 in1p output state control 2 in1n output state control 3 sgnd1 small signal gnd 4 po1 output state output (open drain) 5 pgnd1 output part gnd 6 pgnd1 output part gnd 7 out1p motor output 8 out1p motor output 9 out1n motor output 10 out1n motor output 11 pv cc 1 power supply 12 pv cc 1 power supply 13 pv cc 2 power supply 14 pv cc 2 power supply 15 out2n motor output 16 out2n motor output 17 out2p motor output 18 out2p motor output 19 pgnd2 output part gnd 20 pgnd2 output part gnd 21 po2 output state output (open drain) 22 sgnd2 small signal gnd 23 in2n output state control 24 in2p output state control figure 3. block diagram in1p in1n sgnd1 po1 pgnd1 out1p out1p out1n out1n pvcc1 output state detection pgnd1 in2p in2n sgnd2 po2 pgnd2 out2p out2p out2n out2n pvcc2 pgnd2 pvcc1 pvcc2 tsd ocp ovp control state logic tsd ocp ovp output state detection control state logic internal power supply internal power supply downloaded from: http:///
3/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M absolute maximum ratings (ta=25c) parameter symbol rating unit power supply voltage (pvcc1,2) v cc 60 v output voltage (out1p, out 2p , out1n, out 2n ) v out 60 v input voltage ( po 1,2) v po 60 v input voltage ( in 1p , in 2p , in 1n , in 2n ) v in -0.3 to + 20 v output current (note 1) i o 1.0 a power dissipation (note 2) pd 3.99 w operating temperature range topr - 40 to +110 c storage temperature range tstg - 55 to + 15 0 c junction temperature tjmax 150 c (note 1) pd should not be exceeded (note 2) derating in done 31.9 mw/c for operating above ta 25 c (mount on 4-layer 70.0mm x 70.0mm x 1.6mm board, rohm standard board) caution: operating the ic over the absolute maximum ratings may damage the ic. th e damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is importa nt to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=25c) parameter symbol min typ max unit power supply voltage range (note 1) v cc 8 12 36 v input voltage range ( in 1p , in 2p , in 1n , in 2n ) (note 2) v in -0.3 +5.0 +6.0 v output voltage range ( po 1,2) v po - 5.0 6.0 v (note 1) pd should not be exceeded (note 2) in order to start operation while in forward or reverse mode, appl y a voltage to all input pins after vcc exceeds the minimum operating voltage range (8v). downloaded from: http:///
4/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M electrical characteristics (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) parameter symbol li mits unit conditions measurement circuit (note 1) min typ max circuit current 1 i cc1 - 0 10 a ch1 & ch2 : v in 0 .4 v 1 circuit current 2 i cc2 - 4 8 ma ch1 or ch2 : 0.4v < v in 1 circuit current 3 i cc3 - 8 16 ma ch1 & ch2 : 0.4v < v in 1 input h voltage v ih 3.0 - - v 1 input l voltage v il - - 1.0 v 1 input h current i ih 25 50 100 a v in = 5.0v, inflow current 1 input l current i il - 0 10 a v in = 0.0v, outflow current 1 output on resistance 1 r on1 - 2.25 3.50 io = 0.1 a to 0.8 a, ta = - 40 c to + 25 c, upper and lower total 2 output on resistance 2 r on2 - 3.50 4.50 io = 0.1a to 0.8 a, ta = 25 c to 110c, upper and lower total 2 output leak current h i lh - 0 10 a v out = 0v, stand-by mode 3 output leak current l i ll - 0 10 a v out = v cc , stand-by mode 3 output diode voltage h v fh 0.2 0. 9 1.4 v i o = 0.6a , v cc = 0v, stand-by mode 2 output diode voltage l v fl 0.2 0. 9 1.4 v i o = 0.6a , v cc = 0v, stand-by mode 2 protection output pin voltage l v lpo - 0. 2 0.6 v i po = 3ma , for activating the overcurrent protection 2 protection output pin leakage current i lpo - 0 10 a v po = v cc , for activating the overcurrent protection 3 overcurrent detect current i ocp 1.050 1.275 1.550 a 2 overvoltage detect voltage v ovp 45 50 55 v 1 (note 1) see pages 15 and 16. truth table input output operating mode in1p , in 2p in1n , in 2n out1p, out 2p out1n, out 2n h h l l brake h l h l forward rotation l h l h reverse rotation l l open open stand- by downloaded from: http:///
5/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 supply voltage v cc [v] circuit current i cc1 [a] figure 4. circuit current vs supply voltage (circuit current 1 i c c1 , v cc =0v to 60v, v in =0v (stand-by mode)) 0 1 2 3 4 5 6 7 8 5 10 15 20 25 30 35 40 supply voltage v cc [v] circuit current i cc2 [ma] figure 6. circuit current vs supply voltage (circuit current 2 i c c2 , ch1 : v in =5.0v (brake mode), ch2 : v in =0v (stand-by mode)) ta=25c ta=- 40 c ta=110c ta=110c ta=- 40 c ta=25c 0 1 2 3 4 5 6 7 8 -50 0 50 100 150 temperature ta[c] circuit current i cc2 [ma] figure 7. circuit current vs temperature (circuit current 2 i c c2 , ch1 : v in =5.0v (brake mode), ch2 : v in =0v (stand-by mode)) 0 1 2 3 4 5 6 7 8 9 10 -50 0 50 100 150 temperature ta[c] circuit current i cc1 [a] figure 5. circuit current vs temperature (circuit current 1 i c c1 , v in =0v (sta nd -by mode)) v cc =12v v cc =8v v cc =36v v cc =12v v cc =8v v cc =36v downloaded from: http:///
6/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data ) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 0 2 4 6 8 10 12 14 16 5 10 15 20 25 30 35 40 supply voltage v cc [v] circuit current i cc3 [ma] figure 8. circuit current vs supply voltage (circuit current 3 i c c3 , v in =5.0v (brake mode)) 0 1 2 3 4 5 6 7 8 0 5 10 15 20 input voltage v in [v] circuit current i cc2 [ma] figure 10. circuit current vs input voltage (circuit current 2 i c c2 , v cc =12v) ta=110c ta=- 40 c ta=25c ta=25c 0 2 4 6 8 10 12 14 16 -50 0 50 100 150 temperature ta[c] circuit current i cc3 [ma] figure 9. circuit current vs temperature (circuit current 3 i c c3 , v in =5.0v (brake mode)) v cc =12v v cc =8v v cc =36v ta=- 40 c ta=110c downloaded from: http:///
7/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 5 10 15 20 25 30 35 40 supply voltage v cc [v] input voltage v ih [v] figure 11. input voltage vs supply voltage (input h voltage v ih , v in =0v 5.0v) ta=25c 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 -50 0 50 100 150 temperature ta[c] input voltage v il [v] figure 14. input voltage vs temperature (input l voltage v il , v in =5.0v 0v) ta=110c ta=- 40 c 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 5 10 15 20 25 30 35 40 supply voltage v cc [v] input voltage v il [v] figure 13. input voltage vs supply voltage (input l voltage v il , v in =5.0v 0v) ta=25c ta=110c ta=- 40 c v cc =12v v cc =8v v cc =36v 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 -50 0 50 100 150 temperature ta[c] input voltage v ih [v] figure 12. input voltage vs temperature (input h voltage v ih , v in =0v 5.0v) v cc =12v v cc =8v v cc =36v downloaded from: http:///
8/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 5 10 15 20 25 30 35 40 supply voltage v cc [v] input voltage v in [v] figure 15. input voltage vs supply voltage (circuit current active voltage, v in =0v 5.0v) figure 16. input voltage vs temperature (circuit current active voltage, v in =0v 5.0v) 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 -50 0 50 100 150 temperature ta[c] input voltage v in [v] ta=110c ta=- 40 c ta=25c v cc =12v v cc =8v v cc =36v 0 50 100 150 200 250 300 350 400 450 500 0 5 10 15 20 input voltage v in [v] input current i ih [a] figure 17. input current vs input voltage (input current i ih , i il ) figure 18. input current vs input voltage (input current i ih , i il ) ta=110c ta=- 40 c ta=25c 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 input voltage v in [v] input current i ih [a] ta=110c ta=- 40 c ta=25c downloaded from: http:///
9/ 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] output on resistance r on [] figure 19. output on resistance vs output current (output on resistance high side, v cc =12v) ta=25c ta=- 40 c ta=110c 0.0 0.3 0.6 0.9 1.2 1.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] output on resistance r on [] figure 21. output on resistance vs output current (output on resistance low side, v cc =12v) ta=110c ta=- 40 c ta=25c 0.0 0.3 0.6 0.9 1.2 1.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] output on resistance r on [] figure 22. output on resistance vs output current (output on resistance low side, ta=25c ) 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] output on resistance r on [] figure 20. output on resistance vs output current (output on resistance high side, ta=25c ) v cc =8v v cc =36v v cc =12v v cc =12v v cc =8v v cc =36v downloaded from: http:///
10 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 0.0 0.5 1.0 1.5 2.0 2.5 5 10 15 20 25 30 35 40 supply voltage v cc [v] output on resistance r on [] figure 23. output on resistance vs supply voltage (output on resistance high side, i o =0.8a) 0.0 0.3 0.6 0.9 1.2 1.5 -50 0 50 100 150 temperature ta[c] output on resistance r on [] figure 26. output on resistance vs output current (output on resistance low side, i o =0.8a) ta=25c ta=- 40 c ta=110c 0.0 0.3 0.6 0.9 1.2 1.5 5 10 15 20 25 30 35 40 supply voltage v cc [v] output on resistance r on [] figure 25. output on resistance vs supply voltage (output on resistance low side, i o =0.8a) ta=25c ta=- 40 c ta=110c v cc =8v v cc =36v v cc =12v 0.0 0.5 1.0 1.5 2.0 2.5 -50 0 50 100 150 temperature ta[c] output on resistance r on [] figure 24. output on resistance vs temperature (output on resistance high side, i o =0.8a) v cc =8v v cc =36v v cc =12v downloaded from: http:///
11 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 supply voltage v cc [v] leak current i lh [a] figure 27. leak current vs supply voltage (output leak current high side i lh , v out =0v, ta=110c ) 0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 supply voltage v cc [v] leak current i ll [a] figure 28. leak current vs supply voltage (output leak current low side i ll , v out =v cc , ta=110c ) figure 29. output voltage vs input current (output diode voltage high side v fh , v cc =0v) figure 30. output voltage vs input current (output diode voltage low side v fl , v cc =0v) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.2 0.4 0.6 0.8 1.0 input current i o [a] outpu voltage v fh [v] 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.2 0.4 0.6 0.8 1.0 input current i o [a] outpu voltage v fl [v] ta=25c ta=- 40 c ta=110c ta=25c ta=- 40 c ta=110c downloaded from: http:///
12 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) figure 3 1. po output voltage vs supply voltage (po pin output voltage v lpo , i po =3ma, for activating the overcurrent protection ) figure 32. po output voltage vs temperature (po pin output voltage v lpo , i po =3ma, for activating the overcurrent protection ) 0 100 200 300 400 500 600 5 10 15 20 25 30 35 40 supply voltage v cc [v] output voltage v lpo [mv] ta=25c ta=- 40 c ta=110c figure 33. leak current vs input voltage (po pin leak current ilpo, v po =v cc , ta=110c ) 0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 input voltage v po [v] leak current i lpo [a] 0 100 200 300 400 500 600 -50 0 50 100 150 temperature ta[c] output voltage v lpo [mv] v cc =8v v cc =36v v cc =12v downloaded from: http:///
13 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 5 10 15 20 25 30 35 40 supply voltage v cc [v] output current i ocp [a] figure 34. ocp detect current vs supply voltage (ocp detect current high side i ocp , i o =1.05a 1.55a) 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 5 10 15 20 25 30 35 40 supply voltage v cc [v] output current i ocp [a] figure 35. ocp detect current vs supply voltage (ocp detect current low side i ocp , i o =1.05a 1.55a) 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 -50 0 50 100 150 temperature ta[c] output current i ocp [a] figure 36. ocp detect current vs temperature (ocp detect current high side i ocp , i o =1.05a 1.55a) 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 -50 0 50 100 150 temperature ta[c] output current i ocp [a] figure 37. ocp detect current vs temperature (ocp detect current low side i ocp , i o =1.05a 1.55a) ta=25c ta=- 40 c ta=110c v cc = 8v v cc =36v v cc =12v ta=25c ta=- 40 c ta=110c v cc =8v v cc =36v v cc =12v downloaded from: http:///
14 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 45 46 47 48 49 50 51 52 53 54 55 -50 0 50 100 150 temperature ta[c] supply voltage v cc [v] figure 38. supply voltage vs temperature (ovp detect voltage v ovp , v cc =45v 55v) 40 41 42 43 44 45 46 47 48 49 50 -50 0 50 100 150 temperature ta[c] supply voltage v cc [v] figure 39. supply voltage vs temperature (ovp release voltage, v cc =50v 40v) downloaded from: http:///
15 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves measurement circuits (reference data) (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 1. i cc1 , i cc2 , i cc3 , v ih , v il , i ih , i il , v ovp (1) i cc1 v cc =0v to 60 v, v in =0v (2) i cc2 ch1 : v in =5.0v (brake mode), ch2 : v in = 0v (3) i cc3 v in =5.0v (ch1 & ch2 : brake mode) (4) v ih v in = 0v 5.0v, v in for switching the operation mode (5) v il v in =5.0v 0v, v in for switching the operation mode (6) i ih , i il v cc =0v, v in = 0v to 20v (8) v ovp v cc = 45v 55v40v v cc for activating the overvoltage protection 2. r on1 , r on2 , v fh , v fl , v lpo , i ocp (1) r on1 , r on2 ch1, ch2 : forward or reverse rotate mode i o = 0a to 1.0a, ? high side switch : l ? low side switch : h (2) v fh , v fl ch1, ch2 : stand-by mode v cc =0v, v in =0.0v, i o = 0a to 1.0a, ? v fh switch : h ? v fl switch : l (3) v lpo ch1, ch2 : forward or reverse rotate mode r po =1.6k (i po =3ma), i o =1.55a, switch : h or l (4) i ocp ch1, ch2 : forward or reverse rotate mode r po = 10 k , i o =1.05a 1.55a, ? high side switch : l ? low side switch : h i o for activating the overcurrent protection pvcc1 pvcc1 po1 in1p out1p out1p out1n out1n sgnd1 pgnd1 inin pgnd1 pvcc2 pvcc2 po2 in2p out2p out2p out2n out2n sgnd2 pgnd2 in2n pgnd2 10 f 10k 5v 10 f 10k 5v i cc1 , i cc2 , i cc3 v ovp v ih , v il v ih , v il i ih , i il i ih , i il v ih , v il v ih , v il i ih , i il i ih , i il pvcc1 pvcc1 po1 in1p out1p out1p out1n out1n sgnd1 pgnd1 inin pgnd1 pvcc2 pvcc2 po2 in2p out2p out2p out2n out2n sgnd2 pgnd2 in2n pgnd2 10 f r po 5v 10 f r po 5v v cc v cc v cc v cc v lpo 0 v lpo 0 h l h l h l h l v fh , v fl v fh , v fl v fh , v fl v fh , v fl i ocp i ocp i ocp i ocp r on1 , r on2 r on1 , r on2 r on1 , r on2 r on1 , r on2 figure 41. measurement circuit 2 figure 40. measurement circuit 1 downloaded from: http:///
16 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M typical performance curves measurement circuits (reference data) - continued (unless otherwise specified v cc = 8v to 36v, ta = - 40 c to +110c) 3. i lh , i ll , i lpo (1) i lh , i ll v out = 0v 60v (2) i lpo v po = 0v 60v pvcc1 pvcc1 po1 in1p out1p out1p out1n out1n sgnd1 pgnd1 inin pgnd1 pvcc2 pvcc2 po2 in2p out2p out2p out2n out2n sgnd2 pgnd2 in2n pgnd2 i lpo i lh , i ll i lh , i ll i lh , i ll i lh , i ll i lpo figure 42. measurement circuit 3 downloaded from: http:///
17 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M timing chart 1. overcurrent protection (ocp ) timing chart (inp=h, inn=l, forward rotate mode , ta=25 c ) normal abnormal normal 0 i o i ocp out1p/2p out1n/2n operating state (h) open state hl po1,2 t on t off t on = 10 sec(typ), 4 sec(min), 22 sec(max) t off = 255 sec(typ), 170 sec(min), 340 sec(max) operating state (l) open state figure 43 . overcurrent protection timing chart (1) the overcurrent protection circuit is designed to conduct pro tection operation by the channel (i.e., out1p&out1n or out2p&out2n). (2) the overcurrent protection circuit uses an output voltage d etection system (output current ? output on resistance). (3) if 1.275a (typ) or more current passes through the circuit for a peri od of 10sec (typ), the protection circuit will put the output pins into an open state for a period of 255sec (typ) and subsequently return to the normal operation. if overcurrent continues to pass throu gh the circuit even after returning to the normal operation, the said protection operation will b e repeated. 2. overvoltage protection (ovp ) timing chart (inp=h, inn=l, forward rotate mode, ta=25 c ) 50v(typ) 45v(typ) out1p/2p out1n/2n open state operating state (h) normal protection normal pvcc1,2 po1,2 hl operating state (l) open state figure 44 . overvoltage protection timing chart (1) the overvoltage protection circuit is designed to condu ct protection operation by the channel (i.e., out1p&out1n or out2p&out2n). (2) if voltage applied to pvcc1or 2 pin exceeds 50v (typ), the protection circuit will put the output pins into an open state and if the voltage falls below 45v (typ), it will return to the normal operation. (3) the protection circuit is activated only while in forw ard, reverse, or brake mode and not activated while in standby mode. (4) if power supply voltage exceeds the absolute maximum rating even when the overvoltage protection circuit is activated, the motor driver can break down. downloaded from: http:///
18 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M timing chart - continued 3. thermal shutdown (tsd ) timing chart (inp=h, inn=l, forward rotate mode ) 175c(typ) 150c(typ) out1p/2p out1n/2n open state operating state (h) normal protection normal temp po1,2 hl open state operating state (l) figure 45 . thermal shutdown timing chart (1) the thermal shutdown circuit is designed to conduc t protection operation by the channel (i.e., out1p&out1n or out2p&out2n). (2) if ic chip temperature (tj) exceeds 175 ? c (typ), the circuit will put the output pins into an open state and if the temperature falls below 150 ? c (typ), it will return to the normal operation. downloaded from: http:///
19 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M recommended application example (note 1)(note 2) figure 46. bd16922efv- m recommended application example (note 1) the external circuit constants shown in the diagram above represent a recommended value, respectively. (note 2) the external resistors po1 and po2 are a pull-up resistor. cautions on designing of application circuits 1. applicable motors be noted that the BD16922EFV-M motor driver can only drive dc motors and c annot drive stepping motors. furthermore, in order to use this motor driver for any motors other than autom otive motors (for air conditioners and door mirrors), contact your rohm representative. 2. use of only either one of ch1 and ch2 to use only either one of ch1 and ch2, cause a short circ uit between pvcc1 and pvcc2 as shown in figure 46., a nd then fix the input not to be used to the l (low) level. 3. pvcc1 and pvcc2 be sure to mount a power supply decoupling capacitor in the vicinity of the ic pins between the power supply and the ground. determine the capacitance of the capacitor after full y ensuring that it presents no problems in characteristics. furthermore, cause a short circuit between pvcc1 and pvcc2 (set them to the s ame potential) before using the ic. 4. input pin voltage this ic provides guarantee for circuit operation at input h voltage and input l voltage (see page 4). using the ic at intermediate potential (with v in set to 1.0v to 3.0v) may disable the normal operation of any of the protection functions. to avoid that, apply 50mv/s or more input voltage. 5. counter-electromo ti ve force the counter-electromotive force may vary with operating conditio ns and environment, and individual motor characteristics. fully ensure that the counter-electromotive force presents no pro blems in the operation or the ic. 6. fluctuations in outp ut pin voltage if any output pin makes a significant fluctuation in the vol tage to fall below gnd potential due to heat generation conditions, power supply, motor to be used, or other conditi ons, this may result in malfunctions or other failures. in such cases, take appropriate measures, including the addition of a schottky diode between the output pin and ground. in1p 1 2 in1n sgnd1 3 po1 4 pgnd1 out1p 5 out1p 7 out1n 8 out1n 9 pvcc1 10 12 in2p 24 23 in2n sgnd2 22 po2 21 pgnd2 19 out2p 18 out2p 17 out2n 16 out2n 15 pvcc2 13 BD16922EFV-M 5v input 1 5v 4.7k motor 2 pgnd1 6 pvcc1 11 pgnd2 20 pvcc2 14 thermal pad 100k to 4.7k 100k to m m 10 f 10 f motor 1 input 2 input 3 input 4 downloaded from: http:///
20 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M cautions on designing of application circuits - continued 7. large-current lines a large current passes through the power supply pins pvcc1 and 2 of the ic motor block and the pgnd1 and 2 pins of the motor block. this large current causes backflow depe nding on board pattern layout or external circuit constants s uch as the capacitance of the capacitor between the power supp ly and ground, thus leading to malfunctions, oscillation , or other unfavorable results. to avoid that, layout a board patt ern using thick interconnects wherever possible and recommended values like those shown in figure 46. as e xternal circuit constants, and then fully ensure that the layout presents no problems in characteristics. after that, determine the board pattern layout. 8. rush current this ic has no built- in circuit that limits rush currents caused by applying curre nt to the power supply or switching operation mode. to avoid the rush currents, take physical m easures such as adding a current-limiting resistor between pvcc1/2 pins and the power supply. 9. thermal p ad since a thermal pad is connected to the sub side of this ic, connect it to the ground potential. furthermore, do not use the thermal pad as ground interconnect. 10. overvoltage protection this ic has a built-in overvoltage protection function that protects output pins when overvoltage is applied. if vo ltage applied to pvcc1 and 2 pins exceeds 50v (typ), the output pin will open. however, note that this function is only enabled while in forward, reverse, or brake mode and disabl ed while in standby mode. furthermore, since the built-in overvoltage protection function may break down if voltage exce eds the absolute maximum rating of power supply voltage, do not apply voltage exceeding the absolute maximum rating. 11. overcurrent protection this ic has a built-in overcurrent protection function that pro tects it from breakdown when the output pin is short-circuite d. overcurrent protection is a function that protects the ic from break down due to short-circuited output pin, but is likely to cause the ic to generate heat or deteriorate if it remains in the overcurrent state and eventually break down. if overcurrent continues to flow (if po pin behaves as shown i n figure 43.), take measures to make the ic standby in terms of application. 12. thermal shutdown this ic has a built-in thermal shutdown circuit as an ov erheat-protection measure. the thermal shutdown circuit is a circuit absolutely intended to protect the ic from thermal runaw ay, not intended to protect or guarantee the ic. consequently, do not operate the thermal shutdown circuit ba sed on the subsequent continuous use or operation of th e circuit. downloaded from: http:///
21 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M power dissipation ??` ta ? 150 125 110 10 0 75 50 25 0 1.0 2.0 3.0 3.99 pd w figure 47 . BD16922EFV-M power dissipation derating in done 31.9 mw/c for operating above ta 25 c (mount on 4-layer 70.0mm x 70.0mm x 1.6mm board, rohm standard board) downloaded from: http:///
22 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M i/o equivalence circuits (note 1) pin no. pin name i/o equivalence circuit 1 2 23 24 in1p in1n in2n in2p in1p/2p in1n/2n 100k 100k 1 2 23 24 sgnd1,2 22 3 pvcc1,2 12 11 14 13 3 22 sgnd1 sgnd2 - 4 21 po1 po2 22 30 sgnd1,2 po1,2 4 21 3 5 6 19 20 pgnd1 pgnd1 pgnd2 pgnd2 - 7 8 9 10 15 16 17 18 out1p out1p out1n out1n out2n out2n out2p out2p pvcc1,2 out1p/2p out1n/2n pgnd1,2 11 12 13 14 7 8 9 10 15 16 17 18 5 6 19 20 11 12 13 14 pvcc1 pvcc1 pvcc2 pvcc2 - (note 1) resistance values shown in the diagrams above represent a typical lim it, respectively. downloaded from: http:///
23 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block. furthermore, connect a capacitor to ground at all power s upply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sign al ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result i n deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is w hen the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and dela ys, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacit ors completely after each process or step. the ics powe r supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. downloaded from: http:///
24 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M operational notes - continued 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor . the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the sma ll charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutua l interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) shoul d be avoided. figure 48 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric co nstant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and p ower dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ra ting is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
25 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M ordering information b d 1 6 9 2 2 e f v - me2 part number package efv:htssop-b24 packaging and forming specification m : for automotive e2: embossed tape and reel marking diagrams htssop-b24 (top view) 1 6 9 2 2 e f v part number marking lot number 1pin mark downloaded from: http:///
26 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M physical dimension, tape and reel information package name htssop-b24 downloaded from: http:///
27 / 27 tsz02201-0g1g0b300330-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.sep.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BD16922EFV-M revision history date revision changes 03 .oct.2013 001 new release 29 .may.2015 00 2 p.1 note1 add comment note2 add comment 11.sep.2015 003 none (adjust revision number between japanese version and english version) downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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